we are dealing with a work concerning recovery of Au and Pd from E-boards and we have determined that most of Au (92%) is contained in some components that are about 12% weigth of the entire board.
These components are tightly soldered to the board.

In a large-scale recovery of gold, if any, is it common to attack the entire board or to select the valuable components of it ? I mean not manually, but automatically, in view of an industrial application; in other words, do you mean it would be possible to separate the components from the base of the board and choose among them the valuable ones ? Which apparatus can we use.

In the case of attack of the entire board the gold dilutes and the problems of purification increase.

thank you for helping